Ball Grid Array Example for the Surface Evolver

BGA image A ball grid array (BGA) joint is a bead of solder between two circular pads. Arrays of these joints are used to mount chips on circuit boards. This set of examples models one such joint, beginning very simply and adding features until a fairly complex model is reached. A list of the various datafiles is below, with brief descriptions. Each datafile has its own page, which elaborates on the added features and their implementation. Note that the ordering of the datafiles is tree-like, rather than linear. The complete set of datafiles and auxiliary command files is available in bga-files.zip or bga-files.tar.
NOTE: These models require Evolver version 2.12 (March 21, 1999) or higher to run. One of the benefits of writing my own software is that if it needs features, I can add them. Some of the datafiles could run on old versions with a little editing, but some definitely need the new features.

It is assumed that you are familiar with the operation of the Surface Evolver at least to the level of the basic Evolver Tutorial examples cube.fe, cat.fe, and mound.fe.

The general sequence of steps in modeling a surface is:

The Datafiles:

The sequence of datafiles starts simple and adds features. The sequence is not strictly linear; the main sequence keeps the contact surface on the chip explicitly represented by facets, and a sideline replaces those facets with edge integrals. Each datafile link here opens a commentary page, from which one can also open the datafile in a separate browser window. The idea is to be able to look at the commentary and datafile simultaneously. The datafiles themselves also contain a little commentary. You are also urged to have the Evolver running and run the models as they are discussed.
Last modified 6/2/2013.
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